BACKGROUNDThe purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government`s anticipated needs.The National Institute of Standards and Technology (NIST) CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas. For more information on CHIPS Metrology, please visit https://www.nist.gov/chips/research–development–programs/metrology–programCHIPS Metrology researchers at NIST Gaithersburg require high–throughput high–resolution non–destructive three–dimensional (3D) X–ray imaging to support research within grand challenges for Advanced Metrology for Future Microelectronics Manufacturing, Enabling Metrology for Integrating Components in Advanced Packaging, and Standardizing New Materials, Processes, and Equipment for Microelectronics.NIST anticipates procuring an X–ray laminography/tomography system and is seeking information from manufacturers capable of meeting the following needs:System Resolution and Scan Speed: The system must be able to resolve 1 µm Metal/Non–metal line and space pattern while operating with a scan speed of at least 0.5 mm3/min. Exceeding the resolution and scan speeds increases the value to the government and additional consideration will be given to systems that can exceed one or both parameters. The government anticipates this specification to be met in laminography mode.Spatial resolution is defined as the minimum line pair thickness that can be resolved. For example, a 1 µm line pair is composed of a 500 nm–thick line of dark intensity and 500 nm–thick line of bright intensity i