The client is seeking information regarding an electrical performance monitoring system to support time–resolved data generation for populating an open-source physical property database. This system is a critical component of a CHIPS project that centers on the reliability of advanced packaging in heterogeneously integrated semiconductor devices.

Requirements for the solution include support for multiuser software environments, EIS (Electrochemical Impedance Spectroscopy) testing and fitting capabilities, as well as the preferred ability to integrate external data loggers and temperature monitoring systems, with support for incorporating integrated file data. The solution will underpin research and reliability assessment activities for advanced semiconductor device packaging.