Data Centre Modules Solution
Location:
Washington, District of Columbia, United States
Posted on:
Jan 23, 2026
Deadline:
Feb 16, 2026
Summary:
Seeking modular and scalable data centre module solutions in Washington, DC, including on-premise and off-premise hosting for AI compute expansion with TIER III redundancy.
Get full access to this RFP
(1) Vendor needs to provide data centre modules solution. • Modular, and scalable solutions to host Data Centre on-premise and off premise capabilities, for traditional and high–density computing (primarily for Artificial Intelligence (AI) compute expansion), at TIER III level of redundancy • Framework will provide for global reach provisions across the footprint, via several Industry providers who qualify for a place under the framework. • Acquisition options include rental (Infrastructure as a Service – IaaS) as managed with provider-supplied equipment, and procurement of containers, depending upon the customer and site-specific requirements.
