Data Acquisition System
Location:
Maryland, USA
Posted on:
Dec 13, 2025
Deadline:
Dec 26, 2025
Summary:
RFI for a data acquisition system to support semiconductor packaging reliability studies in Maryland.
(1) Vendor needs to provide data acquisition system to the government authority located in Maryland.– Data Acquisition System to collect in–situ resistance–based measurements throughout the structure of advanced test vehicles during accelerated aging experiments as part of a study of long–term reliability of materials used in advanced packaging of semiconductor chips.– Providing the semiconductor industry with an accurate material property database of polymeric packaging components throughout long–term aging and a new, more accurate reliability model, long–term reliability design efficiency (both time and cost savings) will be greatly improved.– Data logging software must be included.– Data analysis and export capability.– Must be compatible with Windows 10/11.
