A government authority in Maryland is seeking information from vendors regarding a data acquisition system to support semiconductor packaging reliability studies. The required system will collect in-situ, resistance-based measurements throughout the structure of advanced test vehicles during accelerated aging experiments. This data will contribute to a comprehensive study focused on the long-term reliability of materials used in the advanced packaging of semiconductor chips.

The goal is to develop an accurate material property database for polymeric packaging components as they age, enabling more precise and efficient reliability modeling for the semiconductor industry. The system should include data logging software, data analysis and export capabilities, and must be compatible with Windows 10 and 11 operating systems.